CCI: CANADIAN CIRCUITS INC., CAPABILITY Laminates Rohs Compliant-EU Directive 2002/95/EC Standard Board Thickness and Tolerance NEMA FR-4 / IPC-4101/21/24 UL 796 DSR and 94V-0 Rated 130° - 170° Tg External base copper - 0.25 oz to 10.0 oz Internal base copper - 0.5 to 3.0 oz copper Per IPC-4101 Class b 0.020" +/- 10% 0.031" +/- 10% 0.062" +/- 10% Quality System Standards Solder Mask Type/ Sun Chemical XV501T-4 Series A ISO-9001-2008 Acceptability Criteria IPC-A-600 Latest revision, Class 1, 2 and 3 Performance Specification IPC-6012, UL 796, 94V-0 Liquid Photoimageable ( LPI ) IPC-SM-840 0.003" Minimum Solder Dam Web Color: Green, Red, Black, Yellow, White, Blue 0.093" +/- 10% 0.125" +/- 10% Board Flatness Standard Plating Thickness Per IPC-6012 Surface Mount Product 0.75% of PCB diagonal measurement = 0.0075 inch/inch All Other Product 1.5% of PCB diagonal measurement = 0.015 inch/inch Copper = 0.001" - 0.002" Nickel = 50 - 200 micro inches Flash Gold = 5 - 10 micro inches Immersion Gold = 3 - 5 micro inches Immersion Silver = 8 - 16 micro inches, Annular Ring Requirements For Via Hole Production 0.005" Prototype 0.004" Immersion Tin = 20 - 40 micro inches Annular Ring Requirements For SolderMask Advance 0.003" Production 0.002" Prototype 0.0015" Advance 0.001" Maximum Number Of Layer Standard Core Dielectric Selection 16 0.005", 0.008", 0.014", 0.028", Other sizes, Special Ord Final Board Dimensional Tolerances/ Per IPC-2615 Annular Ring Requirements For Component Hole Production (+/-) 0.010" Production 0.008" Prototype (+/-) 0.005" Advance (+/-) 0.003" Minimum Surface Mount Pitch SMT Pitch 0.008" Prototype 0.007" Advance 0.005" Minimum Conductor Width / Space Spacing 0.004" Production 0.005"/ 0.005" Prototype 0.004" / 0.004" Advance 0.003" / 0.003" Finished Hole Diameter Tolerance For Plated Through Holes Finished Hole Diameter Tolerance For Nonplated Holes +/- 0.003" +/- 0.001" Conductor Width, Spacing and Thickness Tolerances For Finish Product Quality and Testing Capabilities Per IPC- 6012 Conductor Width not to exceed 20% reduction from original films Conductor Spacing not to exceed 20% reduction from original films Conductor Thickness not to exceed 20% reduction from required finished thickness ( inlusive of base copper and copper plating ) CMI Measurement System CamTek AOI Gerber Netlist tesing standard Mania Loc 8 Flying Probe Tester Probot 880 Flying Probe Tester MicroCraft EMMA ELX 6146 flying probe tester Minimum Finished Hole Diameter Test Ranges Standard Plated through holes = 0.005" Nonplated through holes 0.005" Continuity Resistance = 10 Ohm Isolation Resistance = 0 - 100 Megohms Voltages = 150 VDC 10 Ohm 10M Ohm 50 VDC Controlled Impedance +/- 10%
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