TU1007 SERIES

TU1007 SERIES
1.00mm Pitch Wire To Board Connector
Specification
Circuits
8,14,20,30
Pitch
1.00mm
Current Rating
1A AC/DC
Voltage Rating
100V AC/DC
Contact Resistance
Withstand Voltage
300V AC/minute
Insulation Resistance
at
e
Temperature Range
ng
m
Applicable Wire Range
AWG #28 - #34
Assembly Layout
Right Angle SMT Type
Ki
Right Angle SMT
Inside Type
TU1007 * - NP * - * - * - *
1
1 Part No. TU1007
2 Connection Type:
HNO : Terminal Socket
WNR : Right Angle Wafer
3 Number of Contacts:
NP : Circuits
2
3
4
5
6
7
6 Material Code
4 Mount Type
Blank : As Specified
SI : With Shield Housing
S1 : Phosphor bronze Tin-plated
SB : SMT-Type Wafer With Shield
M5 : Nylon 46 UL 94V-0
M8 : LCP UL 94V-0
SIB : SMT Inside-Type Wafer With Shield
7 Product Color
Blank : As Specified
C* : Color of number
5 Contact Plating Code
Blank : As Specified
GO : Gold-flash over Nickel
Note:Color of number(0-White, 1-Black, 2-Brown, 3-Red, 4-Orange, 5-Yellow, 6-Green, 7-Blue, 8-Purple, 9-Grey).
TU1007 SERIES
1.00mm Pitch Wire To Board Connector
Unit : mm
Terminal
ng
m
at
e
Features
Use with: TU1007 Series Housing
CONTACT INFORMATION
Part No.
Wire Range
Insulation O.D.
DIM.(mm)
B
A
Material
Finish
Q'ty/Reel
15,000pcs
TU1007TPH-* AWG #28-#30 0.60mm(MAX.) 1.05 1.15
Phosphor bronze See note
20,000pcs
TU1007TPL-* AWG #32-#34 0.40mm(MAX.) 0.95 0.90
Note:
Ki
For this product in a different specification please contact KM for more information
Housing
With Shield
Features
Available Number of Circuits: 08,14,20,30
Material: High Temperature Thermoplastic 94V-0 or
Thermoplastic 94V-0
Shield : Copper Alloy , Tin-plated
Use with: TU1007 Crimp Terminal
Mates with : TU1007 Series Wafer
Dimension and Order Information
DIM.(mm)
Circuits
Part No.
A
B
8
TU1007HNO-08-S1-* 7.00 8.40
14
TU1007HNO-14-S1-* 13.00 14.40
20
TU1007HNO-20-S1-* 19.00 20.40
TU1007HNO-30-S1-* 29.00 30.40
30
TU1007 SERIES
1.00mm Pitch Wire To Board Connector
Wafer
Unit : mm
With Shield Right Angle SMT Type
at
e
Features
Available Number of Circuits : 08,14,20,30
Material :High Temperature Thermoplastic 94V-0
Contact : 0.20mm(.008") Flat Pin Copper Alloy,
Matte-Tin
Mates with : TU1007 Series Housing
Wafer
ng
m
P.C.B LAYOUT
Dimension and Order Information
DIM.(mm)
Part No.
Circuits
A
B
8
TU1007WNR-08SB-*-* 7.00 11.55
14
TU1007WNR-14SB-*-* 13.00 17.55
20
TU1007WNR-20SB-*-* 19.00 23.55
TU1007WNR-30SB-*-* 29.00 33.55
30
With Shield Right Angle Inside SMT Type
Ki
Features
Available Number of Circuits : 08,14,20,30
Material : High Temperature Thermoplastic 94V-0
Contact : 0.20mm(.008") Flat Pin
Copper Alloy, Matte-Tin
Mates with : TU1007 Series Housing
P.C.B LAYOUT
Dimension and Order Information
DIM.(mm)
Circuits
Part No.
A
B
8
TU1007WNR-08SIB-*-* 7.00 11.55
14
TU1007WNR-14SIB-*-* 13.00 17.55
20
TU1007WNR-20SIB-*-* 19.00 23.55
TU1007WNR-30SIB-*-* 29.00 33.55
30
TS1007 SERIES
1.00mm Pitch Wire To Board Connector
Specification
Circuits
8,14,20,30
Pitch
1.00mm
Current Rating
0.5A AC/DC
Voltage Rating
100V AC/DC
Contact Resistance
Withstand Voltage
300V AC/minute
Insulation Resistance
at
e
Temperature Range
AWG #40
ng
m
Applicable Wire Range
Assembly Layout
Ki
Right Angle SMT Type
TS1007 * - NP - *
1
1 Part No. TS1007
2 Connection Type:
HNO : Terminal Socket
2
3
4
4 Contact Plating Code
GO : Gold-flash
G*: GOLD *u" Over Nickel
3 Number of Contacts:
NP : Circuits
Note:Color of number(0-White, 1-Black, 2-Brown, 3-Red, 4-Orange, 5-Yellow, 6-Green, 7-Blue, 8-Purple, 9-Grey).
TS1007 SERIES
1.00mm Pitch Wire To Board Connector
Housing
Unit : mm
Soldering Type
Ki
ng
m
at
e
Features
Available Number of Circuits: 8,14,20,30
Material: High Temperature Thermoplastic 94V-0
Contact: Copper Alloy
Shield: Copper Alloy, Tin-plated
Mates with: TU1007 Series Wafer
FRONT SHELL
TS1007EMIPF-NP
Dimension and Order Information
DIM.(mm)
Circuits
Part No.
A
B
C
08
TS1007HNO-08-*-* 7.00 8.50 11.33
14
TS1007HNO-14-*-* 13.00 14.50 17.33
20
TS1007HNO-20-*-* 19.00 20.50 23.33
30
TS1007HNO-30-*-* 29.00 30.50 33.33

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