InnoLas GmbH

Enabling PERC Technology: Reliable and Fast Laser Contact Opening
InnoLas Solutions GmbH
Markus Nicht
CEO
InnoLas Solutions GmbH
September, 2014
INNOLAS GROUP: Milestones …
Foundation of InnoLas Solutions
GmbH (legal successor of PV
business of InnoLas Systems
GmbH)
First Sales of
CIGS Scribing System
Foundation
of InnoLas
Sales of InnoLas Systems GmbH
(Glass Business)
Innovative Processes for
cSi and CIGS sold
Foundation of
InnoLas Inc., USA
First Micro Materials
Processing System
Service Hubs in
Malaysia, Philippines
and Korea opened
Sales SILAS to
Oerlikon Solar, Switzerland
First Wafer Sorting System
1995
1996
1997
1998
1999
First Laser Marking System
2000
2001
2002
2003
2004
2005
First Sales into cSi Solar
First Laser System for R&D
purposes
2006
2007
2008
2009
Foundation of
IL Holding
First Sales into Thinfilm Solar
First 300mm Wafer Marking System
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
Foundation of:
IL Systems GmbH,
IL Semiconductor GmbH,
IL Laser GmbH,
IL SEA Pte Ltd.
2010
2011
2012
Turnover reaching
close to
50 Million EURO
Start of InnoLas
Glass Processing
Division
2013
INNOLAS GROUP: Organization
InnoLas Holding GmbH
InnoLas Solutions GmbH
Laser Processing Systems
for Photovoltaic Industry
InnoLas Laser GmbH
Scientific & Industrial Laser
Sources
InnoLas Semiconductor GmbH
Wafer Marking, Sorting, Handling
Systems
Micro Materials Processing
Laser Sources
Semiconductor Applications
•
•
•
•
•
•
•
•
Laser systems for
photovoltaic applications
Laser systems for electronics &
other substrate processing
Laser systems for
wafer dicing applications
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
For scientific applications
For Industrial applications
Wafer marking systems
Wafer handling systems
Wafer sorting systems
PERC: Contact Opening
Process: Backside Contact Opening
 Ablation of Aluminum-Oxide / SiN film stack, or
ablation of Silicon-Oxide / SiN film stack
 Contact formation at opened regions, using “adapted”
metallization process
 iPERC – line, dash, or dot pattern formation
Advantages
 Proven platform technology from an installed base of >75
LCO laser systems worldwide, running in production
 Fastest process and best Cost of Ownership in the market
 Highest yield and uptime in the market
Throughput
 Up to 3600 wafer / hour
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
PERC: Performance of InnoLas LCO Process
Cell results from several cell manufacturers and tool manufacturing companies:
 After one optimization round, an efficiency gain up to 0.25% compared to established
reference laser processes was found
 The chosen pattern for demonstration was a standard line pattern with 155 scribe lines
(i.e.,1mm line pitch) and 25-45µm line width
 This enables fast scribing speeds, resulting in processing times of ca. 1.3s per wafer which
is the fastest laser process at such high efficiency level in the market
 All developments were tested on state-of-the-art high efficiency PERC solar cells made from
mono (>20%) and multi (>19%) crystalline wafer material
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
PERC: Performance of InnoLas LCO Process
Cell results from several cell manufacturers and tool manufacturing companies:
Passivation
layer
removal
Roughness
of
remaining
surface
Best Process
Performance
Damaging
of Si bulk
material
Melting of
Si-material
Pattern
layout and
alignment
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
Why InnoLas LCO Process shows
better performance?

InnoLas experienced process engineers
understand the complex interaction of laser
with Si to find the best parameter and
process setting for PERC solar cell
PERC: Performance of InnoLas LCO Process
Cell results from several cell manufacturers and tool manufacturing companies:

Demonstrated at different costumer Cell-Designs: AlOx/SiNy and SiOx/SiNy on Mono
and Multi

Efficiency gain against competitor laser process mainly caused by higher Voc because of
better local BSF formation
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
InnoLas ILM-2 Machine Platform
Technology
 Processing of 1 or 2 wafers simultaneously, using high speed
scanners
 Integrated vision alignment and machine calibration
 Machines designed as fully automated stand alone system
or inline concept to be integrated into printing line
 Suitable for all processes, which need less accuracy
alignment (~ 75 µm) as e.g. Cell Cutting, PERC, LCO-Plating
Throughput
 Single Head (SH) up to 2000 wafer / hour
 Double Head (DH) up to 3600 wafer / hour
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
InnoLas ILM-2 Machine Platform
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
InnoLas Lab
Extensive base of state of the art laser sources,
available for application verification & development
 State of the art production tools available in lab for most realistic process development
 Wide variety of laser sources available in lab
 µs // ns // ps – lasers
 CO2 // IR (1064nm) // Green (532nm)
// UV (355nm) // Deep UV (266nm)
 Extensive metrology (optical / electrical) to verify application development
 Highly skilled laser experts, to develop and optimize your application
 We select the right laser for the YOUR application !
ILS-Tools
IMPALA-Tools
LAR-Tools
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
Optical Metrology
3D-Imaging
Electr. Metrology
ILap – Asian Demo Center
New Laser Applications Demo Centre in Taiwan
 InnoLas establishes its new Innovative Laser Applications (ILap) Demo Centre Asia in Taiwan
 Our ILap is located at TaiYuen Industrial Park in HsinChu, Taiwan
 Our ILap is equipped with our latest LCO/ PERC technology
INNOLAS SOLUTIONS GMBH - CONFIDENTIAL INFORMATION
InnoLas Solutions GmbH
Thank-You for
Your Attention
Please see us in
hall 1 booth D15

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