ASEM_ASEMB-Series MDS

Materials Declaration Data Sheet
ASEM_ASEMB
QFN
3.2 x 2.5 mm
19.1
4
Device
Package
Body Size
Weight (mg)
Lead Count
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Item
Item
Leadframe base metal
Copper (Cu)
Iron (Fe)
Phosphorus (P)
Zinc (Zn)
Leadframe plating
Nickel (Ni)
Palladium (Pd)
Gold (Au)
Gold (Au)
Si
Molding Compound
CAS #
% of Compound
60676-86-0
85 - 95%
Trade secret
1 - 5%
Trade secret
1 - 5%
1333-86-4
0.1 - 0.5%
Weight (mg)
7.9211
0.3013
0.3013
0.0430
ppm
415539
15806
15806
2256
Leadframe
CAS #
% of Compound
Weight (mg)
ppm
7440-50-8
7439-89-6
7723-14-0
7440-66-6
97.30%
2.30%
0.25%
0.15%
8.8792
0.2099
0.0228
0.0137
465800
11011
1196
719
7440-02-0
7440-05-3
7440-57-5
91.40%
8.40%
0.18%
0.0492
0.0045
0.0001
2581
236
5
Item
Bond Wires
CAS #
% of Compound
7440-57-5
>99.99%
Weight (mg)
0.0703
ppm
3688
Item
Chip
CAS #
% of Compound
7440-21-3
>99.99%
Weight (mg)
0.7082
ppm
37152
Die Attach
CAS #
% of Compound
Weight (mg)
ppm
Item
Epoxy NEX-130CT
Epoxy resin
Biphenol A Glycidylether
Fused silica
Additive
N/A
25068-38-6
60676-86-0
N/A
15.00%
8.00%
70.00%
7.00%
0.03324
0.01773
0.15511
0.01551
1744
930
8137
814
Proprietary
Proprietary
Proprietary
7440-22-4
16.00%
2.00%
2.00%
80.00%
0.02672
0.00334
0.00334
0.13361
1402
175
175
7009
Weight (mg)
0.1278
0.0213
ppm
6702
1117
Epoxy 8200T
Acrylate resin
Heterocyclic organic compound
Treated Silica
Silver
Item
Siloxane reaction product
Dimethyl siloxane, hydrogen-teminated
Die Coat (Dow Corning Q3-6646)
CAS #
% of Compound
> 60%
N/A
70900-21-9
< 10%

Download Report