Table of Contents Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada – Tel: 613-829-0414 www.chipworks.com Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. © Chipworks Inc. 2014 all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. 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PKG-1407-802 27003OWMR Revision 1.0 Published: September 17, 2014 Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis Table of Contents 1 Introduction 1.1 Device Naming Conventions Used in this Report 1.2 Device Samples Used for Analysis 1.3 Company Profile 1.4 Executive Summary 1.5 Package and Die Summary 2 Device Identification 2.1 Downstream Product 2.2 K9HQGY8S5M Package 2.3 K9ADGD8S0A Die 3 Package Cross-Sectional Analysis 3.1 Analysis Overview 3.2 Package Structure 3.3 K9ADGD8S0A Dies Assembly 3.4 Package PWB Metal Layers and Vias 3.5 PWB Solder Ball 4 Material Analysis 4.1 SEM-EDS Analysis of Package Materials 5 References 6 Statement of Measurement Uncertainty and Scope Variation About Chipworks 3 Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis List of Figures Figure 2.1.1 Samsung Solid State Drive – Back View Figure 2.1.2 Samsung Solid State Drive – PCB Top Figure 2.1.3 Samsung Solid State Drive – PCB Bottom Figure 2.2.1 K9HQGY8S5M Package Photograph – Top Figure 2.2.2 K9HQGY8S5M Package Photograph – Bottom Figure 2.2.3 K9HQGY8S5M Package X-Ray – Plan View Figure 2.2.4 K9HQGY8S5M Package X-Ray Corner A – Detailed Plan View Figure 2.2.5 K9HQGY8S5M Package X- Ray Corner B – Detailed Plan View Figure 2.2.6 K9HQGY8S5M Package X- Ray Corner C – Detailed Plan View Figure 2.2.7 K9HQGY8S5M Package X- Ray Corner D – Detailed Plan View Figure 2.2.8 K9HQGY8S5M Package X-Ray Side A – Overview Figure 2.2.9 K9HQGY8S5M Package X-Ray Side A – Detail Figure 2.2.10 K9HQGY8S5M Package X-Ray Side B – Overview Figure 2.2.11 K9HQGY8S5M Package X-Ray Side B – Detail Figure 2.3.1 K9ADGD8S0A Die Photograph Figure 2.3.2 K9ADGD8S0A Die Markings Figure 2.3.3 K9ADGD8S0A Bonding Pad Figure 2.3.4 K9ADGD8S0A Die Corner A Figure 2.3.5 K9ADGD8S0A Die Corner B Figure 2.3.6 K9ADGD8S0A Die Corner C Figure 2.3.7 K9ADGD8S0A Die Corner D Figure 3.1.1 K9HQGY8S5M Package X-Ray with Cross-Section Location Figure 3.2.1 K9HQGY8S5M Package Cross Section – Optical Overview Figure 3.2.2 K9HQGY8S5M Package Cross Section Detail – SEM Figure 3.2.3 K9HQGY8S5M Package Cross Section Detail – Optical Figure 3.3.1 K9ADGD8S0A Die Assembly – SEM Figure 3.3.2 K9ADGD8S0A Top Die Ball Bonding Figure 3.3.3 K9ADGD8S0A Top Die Ball Bond IMC Figure 3.3.4 K9ADGD8S0A Bottom Die Wire Interconnection – SEM Figure 3.3.5 K9ADGD8S0A Bottom Die Wire Interconnection – Close-Up Figure 3.3.6 K9ADGD8S0A Bottom Die Ball Bond IMC Figure 3.3.7 K9HQGY8S5M PWB Stitch Bond Figure 3.4.1 K9HQGY8S5M Organic PWB General Structure – SEM Figure 3.4.2 K9HQGY8S5M PWB Through-Hole Via Cross Section – SEM Detail Figure 3.4.3 K9HQGY8S5M PWB Through-Hole Via – Plan-View Optical Figure 3.4.4 K9HQGY8S5M PWB Metal 1 Line Width and Pitch – Plan-View Optical Figure 3.4.5 K9HQGY8S5M PWB Metal 2 Features – Optical Plan-View Figure 3.4.6 K9HQGY8S5M PWB Metal 2 Interconnect Trace Width and Pitch – SEM Detail Figure 3.4.7 K9HQGY8S5M PWB Metal 2 Solder Ball Land with Solder Mask – Optical Figure 3.5.1 K9HQGY8S5M Solder Ball – Optical 4 Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis Figure 3.5.2 K9HQGY8S5M Solder Ball – SEM Figure 3.5.3 K9HQGY8S5M Solder Ball IMC – SEM Overview Figure 3.5.4 K9HQGY8S5M Solder Ball IMC – SEM Detail Figure 4.1.1 Molding Compound – SEM-EDS Figure 4.1.2 K9ADGD8S0A Die Coating – SEM-EDS Figure 4.1.3 Bonding Wire – SEM-EDS Figure 4.1.4 K9ADGD8S0A Ball Bond IMC – SEM-EDS Figure 4.1.5 K9ADGD8S0A Bond Pad – SEM-EDS Figure 4.1.6 K9ADGD8S0A Die Substrate – SEM-EDS Figure 4.1.7 K9ADGD8S0A Organic Adhesive – SEM-EDS Figure 4.1.8 PWB Top Solder Mask – SEM-EDS Figure 4.1.9 PWB Stitch Bond Land Top Plating – SEM-EDS Figure 4.1.10 PWB Stitch Bond Land Bottom Plating – SEM-EDS Figure 4.1.11 PWB Metal 1 and Metal 2 – SEM-EDS Figure 4.1.12 PWB Polymer – SEM-EDS Figure 4.1.13 PWB Reinforced Fiberglass Fabric – SEM-EDS Figure 4.1.14 PWB Bottom Solder Mask – SEM-EDS Figure 4.1.15 PWB Solder Ball Land Plating – SEM-EDS Figure 4.1.16 PWB Solder Ball Land IMC – SEM-EDS Figure 4.1.17 Solder Ball – SEM-EDS 5 Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis 6 List of Tables Table 1.2.1 K9HQGY8S5M Component Summary Table 1.5.1 K9HQGY8S5M Package Summary Table 1.5.2 K9ADGD8S0A Die Summary Table 1.5.3 K9HQGY8S5M PWB Interconnect Observed Critical Dimensions Table 1.5.4 K9HQGY8S5M Package Materials Elemental Composition and Vertical Dimensions Table 4.1.1 Molding Compound – Elements Summary Table 4.1.2 K9ADGD8S0A Die Coating – Elements Summary Table 4.1.3 Bonding Wire – Elements Summary Table 4.1.4 K9ADGD8S0A Ball Bond IMC – Elements Summary Table 4.1.5 K9ADGD8S0A Bond Pad – Elements Summary Table 4.1.6 K9ADGD8S0A Die Substrate – Elements Summary Table 4.1.7 K9ADGD8S0A Organic Adhesive – Elements Summary Table 4.1.8 PWB Top Solder Mask – Elements Summary Table 4.1.9 PWB Stitch Bond Land Top Plating – Elements Summary Table 4.1.10 PWB Stitch Bond Land Bottom Plating – Elements Summary Table 4.1.11 PWB Metal 1 and Metal 2 – Elements Summary Table 4.1.12 PWB Polymer – Elements Summary Table 4.1.13 PWB Reinforced Fiberglass Fabric – Elements Summary Table 4.1.14 PWB Bottom Solder Mask – Elements Summary Table 4.1.15 PWB Solder Ball Land Plating – Elements Summary Table 4.1.16 PWB Solder Ball Land IMC – Elements Summary Table 4.1.17 Solder Ball – Elements Summary Samsung K9HQGY8S5M Vertical-NAND Flash Package Analysis About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company’s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world’s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation – earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at 1-613-829-0414. Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T 1-613-829-0414 F 1-613-829-0515 Web site: www.chipworks.com Email: [email protected] Please send any feedback to [email protected]
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